Weekly News Updates: May 14 – May 20

Premier Energies, SAS Forge Joint Venture to Boost Silicon Wafer Manufacturing in India

Premier Energies has entered into a strategic joint venture with Taiwan-based Sino-American Silicon Products Inc. (SAS) to establish a 2 GW per annum silicon wafer manufacturing facility in India. With Premier Energies holding a 74% stake and SAS owning the remaining 26%, the facility will focus on slicing polysilicon ingots into wafers—key components in the production of photovoltaic (PV) cells and solar modules. This venture marks Premier Energies’ shift toward backward integration within the solar value chain and aims to reduce reliance on imports by strengthening local production capabilities. The move aligns with India’s “Make in India” initiative, although no specific government incentives have been disclosed.

The partnership also allows SAS, through its subsidiary Global Wafers Co. Ltd., to expand its presence in India’s rapidly growing solar sector, which has seen a policy-driven push for domestic manufacturing. For non-Indian companies, this joint venture highlights a growing trend of cross-border collaborations in renewable energy, driven by market demand, supply chain diversification, and regional resilience. It signals an opportunity for global firms to engage with India’s clean energy transition while contributing to local value creation.

Editor’s Note: Premier Energies and Taiwan-based SAS have formed a joint venture to establish a 2 GW per year silicon wafer manufacturing facility in India, with Premier Energies holding a 74% stake and SAS owning 26%. This move strengthens India’s solar value chain by enabling local wafer production, reducing reliance on imports, and aligning with the “Make in India” initiative. The partnership also allows SAS, through Global Wafers Co. Ltd., to expand into India’s growing solar sector, reflecting a broader trend of cross-border collaborations in renewable energy.

Foxconn Commits $1.5 Billion to India as Apple Ramps Up Shift from China

Hon Hai Precision Industry Co. (Foxconn), the primary manufacturer of Apple Inc.’s iPhones, is investing $1.5 billion into its India unit via its Singapore-based subsidiary, as part of a strategic move to expand production beyond China. The Taiwan-based company is actively building new facilities and boosting capacity in southern India, aligning with Apple’s goal to source the majority of iPhones sold in the U.S. from India by the end of next year. This shift comes amid rising geopolitical tensions and U.S. trade pressures, with President Joe Biden’s predecessor, Donald Trump, recently criticizing Apple’s overseas production strategy.

Apple’s Indian manufacturing footprint is growing rapidly, with $22 billion worth of iPhones assembled in the country over the 12 months through March—marking a 60% year-on-year increase. Besides Foxconn, Tata Group and Pegatron also play crucial roles in Apple’s local supply chain. For non-Indian companies, this investment reflects a broader trend of supply chain diversification and a growing preference for India as a stable, scalable manufacturing base. It signals opportunities for foreign firms in electronics, logistics, and components to tap into India’s expanding role in the global tech manufacturing ecosystem.

https://www.moneycontrol.com/news/business/apple-partner-hon-hai-injects-1-5-billion-into-india-unit-13033249.html

Editor’s Note: Foxconn is investing $1.5 billion into its India unit to expand production beyond China, supporting Apple’s plan to source most U.S.-sold iPhones from India by next year. Apple’s Indian manufacturing has grown rapidly, with $22 billion worth of iPhones assembled over the past year, as Tata Group and Pegatron also strengthen the local supply chain. This investment highlights India’s increasing role as a stable, scalable manufacturing hub, attracting global firms in electronics, logistics, and components.

India Approves $435 Million HCL-Foxconn Chip Plant Amid Semiconductor Push

India’s cabinet has approved a ₹37.06 billion (USD 435 million) semiconductor fabrication facility to be developed jointly by HCL Group and Taiwan’s Foxconn, according to a Reuters report. The plant, to be located near Jewar airport in Uttar Pradesh, will produce up to 36 million display driver chips annually for devices such as smartphones, laptops, automobiles, and PCs. With a planned monthly capacity of 20,000 wafers, commercial production is expected to begin in 2027. The project is the sixth approved under the India Semiconductor Mission, a key component of Prime Minister Narendra Modi’s strategy to bolster domestic chip manufacturing in a country that currently lacks a fully operational fab.

The HCL-Foxconn announcement follows earlier setbacks, including the collapse of Foxconn’s joint venture with Vedanta in 2023 due to concerns over escalating costs and delays in government incentives. Still, India’s chip ambitions continue to gain momentum. Taiwan’s PSMC and Tata Electronics are building a $11 billion fab in Gujarat, while Micron is investing $2.7 billion in a semiconductor packaging plant. For non-Indian companies, this marks a growing opportunity to engage with India’s emerging semiconductor ecosystem, either through technology partnerships, supply chain integration, or co-investment in a market increasingly viewed as a vital alternative to China and Taiwan.

Editor’s Note: India has approved a $435 million semiconductor plant by HCL and Foxconn near Jewar airport, expected to begin commercial production in 2027, as part of its push to strengthen domestic chip manufacturing. Despite previous setbacks, India’s semiconductor ambitions are gaining momentum, with projects from PSMC, Tata Electronics, and Micron reinforcing its growing role as an alternative to China and Taiwan in the global chip industry.

Pegatron Acquires HTC Taiwan Factories, Boosts India Investments Amid Global Expansion

Pegatron Corporation, a key assembler for Apple’s iPhones, is expanding its global manufacturing footprint with a dual-pronged strategy: acquiring HTC’s factory assets in Taiwan and increasing its investment in India. The company will spend NT$5.64 billion (approximately USD 187 million) to acquire HTC’s factories in Taoyuan, expected to finalize by Q3 2025. These facilities will enhance Pegatron’s capacity to produce consumer electronics, communication devices, and computing products. Additionally, Pegatron is investing NT$578.57 million in India, targeting expansion in communications equipment manufacturing with plans to enter the automotive electronics sector. These moves come as Pegatron also prepares to unveil its latest innovations in AI, smart mobility, and healthcare at the upcoming Computex trade show in Taipei.

The developments follow reports of Tata Group rebranding Pegatron’s India unit as part of its own growing smartphone manufacturing operations. Pegatron’s push into India complements broader industry efforts to diversify beyond China amid tariff concerns and currency fluctuations, which the company says have had minimal impact on revenue. For non-Indian companies, this signals an ongoing shift in global supply chains and a maturing Indian electronics manufacturing ecosystem. It opens the door for foreign suppliers, logistics providers, and technology partners to collaborate with major OEMs as India becomes an increasingly strategic production hub in both consumer and industrial electronics.

https://www.electronicsforyou.biz/industry-buzz/pegatron-to-acquire-htc-factories-in-taiwan-boost-india-operations

Editor’s Note: Pegatron is acquiring HTC’s factory assets in Taiwan for $187 million and investing $578.57 million in India to expand its manufacturing footprint in communications equipment and automotive electronics. This move aligns with broader industry shifts toward supply chain diversification, reinforcing India’s growing role as a strategic production hub for global electronics manufacturing.

Renesas Opens India’s First 3nm Chip Design Centers, Marking Leap in Semiconductor Innovation

Union Minister for Electronics & IT Ashwini Vaishnaw inaugurated two advanced semiconductor design centers of Renesas Electronics India in Noida and Bengaluru on 13 May, marking a major step forward in India’s chip design capabilities. These facilities include the country’s first design center focused on next-generation 3 nanometer (nm) chips, building on earlier achievements at 5nm and 7nm levels. The minister emphasized the milestone as a turning point in India’s holistic semiconductor strategy, which spans the entire value chain from design and fabrication to packaging and raw materials. He noted rising global investor interest and credited Prime Minister Modi’s Aatmanirbhar Bharat vision for the industry’s rapid rise over the past three years.

Renesas CEO Hidetoshi Shibata reaffirmed India’s strategic importance, announcing plans to expand the company’s local footprint and support more than 250 academic institutions and startups through initiatives like Chips to Startup (C2S) and the Design Linked Incentive (DLI) Programme. With design hubs now operating in Noida, Bengaluru, and Hyderabad, Renesas aims to build end-to-end capabilities in India across automotive, industrial, infrastructure, and IoT segments. For non-Indian companies, this development highlights India’s growing role in advanced chip R&D and presents opportunities for partnerships in design, training, and supply chains as global players look to diversify beyond traditional semiconductor hubs.

https://government.economictimes.indiatimes.com/news/technology/india-enters-next-gen-chip-design-era-with-launch-of-first-3nm-design-centers-in-noida-and-bengaluru/121155221

Editor’s Note: Renesas Electronics India has opened two semiconductor design centers in Noida and Bengaluru, introducing the country’s first facility focused on next-generation 3nm chips. This milestone strengthens India’s semiconductor strategy, boosting investor interest and aligning with the Aatmanirbhar Bharat vision for domestic innovation. With expansion plans and academic collaborations, Renesas aims to build end-to-end capabilities in India, reinforcing the nation’s growing role in global chip R&D and advanced technology development.

U.S. Drops AI Chip Export Limits, Opening Doors for Global Allies Including India

In a major policy reversal, the United States has officially withdrawn the controversial “AI diffusion rule” that sought to limit the global export of advanced artificial intelligence (AI) chips. Announced by David Sacks, the new White House lead on AI policy, at the Saudi-US Investment Forum, the move is expected to benefit countries like India that are rapidly scaling AI infrastructure and have lobbied for greater access to high-performance chips from companies like Nvidia. Originally introduced during the final phase of the Biden administration, the rule categorized countries into tiers and imposed restrictions even on U.S. allies, prompting concern among global governments and chipmakers.

Now under President Donald Trump’s administration, the policy shift is being framed as an effort to deepen cooperation with trusted international partners while maintaining safeguards against tech transfer to rivals such as China. For non-Indian companies, especially in AI hardware, cloud computing, and semiconductor manufacturing, the reversal signals a more open global market for U.S. chip technology. It presents new opportunities for collaboration, expansion, and supply chain diversification across emerging AI markets, while reinforcing the need for careful compliance mechanisms to prevent backdoor access by restricted actors.

https://www.indiatoday.in/amp/technology/news/story/us-cancels-biden-era-ai-chip-export-rule-it-may-help-india-get-more-nvidia-chips-for-ai-efforts-2724494-2025-05-14

Editor’s Note: The U.S. has reversed the “AI diffusion rule,” lifting restrictions on AI chip exports to allies like India, which is rapidly scaling its AI infrastructure. The policy shift under President Trump aims to strengthen global tech partnerships while maintaining safeguards against transfers to rivals, opening new opportunities for AI hardware, cloud computing, and semiconductor firms.