Premier Energies, SAS Forge Joint Venture to Boost Silicon Wafer Manufacturing in India
Premier Energies 與台灣中美矽晶（SAS）成立合資企業，提升印度矽晶圓製造能力
Premier Energies has entered into a strategic joint venture with Taiwan-based Sino-American Silicon Products Inc. (SAS) to establish a 2 GW per annum silicon wafer manufacturing facility in India. With Premier Energies holding a 74% stake and SAS owning the remaining 26%, the facility will focus on slicing polysilicon ingots into wafers—key components in the production of photovoltaic (PV) cells and solar modules. This venture marks Premier Energies’ shift toward backward integration within the solar value chain and aims to reduce reliance on imports by strengthening local production capabilities. The move aligns with India’s “Make in India” initiative, although no specific government incentives have been disclosed.
The partnership also allows SAS, through its subsidiary Global Wafers Co. Ltd., to expand its presence in India’s rapidly growing solar sector, which has seen a policy-driven push for domestic manufacturing. For non-Indian companies, this joint venture highlights a growing trend of cross-border collaborations in renewable energy, driven by market demand, supply chain diversification, and regional resilience. It signals an opportunity for global firms to engage with India’s clean energy transition while contributing to local value creation.
小編點評：Premier Energies 與台灣中美矽晶製品股份有限公司（Sino-American Silicon Products Inc., SAS）成立合資企業，在印度建立每年 2GW 的矽晶圓製造廠，由 Premier Energies 持股 74%、SAS 持股 26%。此舉透過在地晶圓生產，強化印度太陽能供應鏈、降低對進口依賴，並呼應「印度製造」（Make in India）倡議。SAS 也藉由旗下環球晶圓（Global Wafers Co. Ltd.）擴展其在印度太陽能產業的布局，顯示出全球再生能源合作與供應鏈在地化的成長趨勢。
Foxconn Commits $1.5 Billion to India as Apple Ramps Up Shift from China
富士康在印度追加 15 億美元投資，蘋果加快從中國轉移生產
Hon Hai Precision Industry Co. (Foxconn), the primary manufacturer of Apple Inc.’s iPhones, is investing $1.5 billion into its India unit via its Singapore-based subsidiary, as part of a strategic move to expand production beyond China. The Taiwan-based company is actively building new facilities and boosting capacity in southern India, aligning with Apple’s goal to source the majority of iPhones sold in the U.S. from India by the end of next year. This shift comes amid rising geopolitical tensions and U.S. trade pressures, with President Joe Biden’s predecessor, Donald Trump, recently criticizing Apple’s overseas production strategy.
Apple’s Indian manufacturing footprint is growing rapidly, with $22 billion worth of iPhones assembled in the country over the 12 months through March—marking a 60% year-on-year increase. Besides Foxconn, Tata Group and Pegatron also play crucial roles in Apple’s local supply chain. For non-Indian companies, this investment reflects a broader trend of supply chain diversification and a growing preference for India as a stable, scalable manufacturing base. It signals opportunities for foreign firms in electronics, logistics, and components to tap into India’s expanding role in the global tech manufacturing ecosystem.
小編點評：富士康透過其新加坡子公司向印度子公司注資 15 億美元，支持蘋果在 2026 年前將大部分銷往美國的 iPhone 轉至印度生產的計畫。富士康正在南印度積極擴廠，而蘋果於過去 12 個月在印度生產價值 220 億美元的 iPhone，年增 60%。塔塔集團與和碩（Pegatron）也是蘋果印度供應鏈中的關鍵角色。此投資凸顯印度作為穩定、可擴展製造基地的地位，也為電子、物流與零組件等國際企業創造合作機會。
India Approves $435 Million HCL-Foxconn Chip Plant Amid Semiconductor Push
印度批准 HCL 與台灣富士康合資建設 4.35 億美元晶片廠，推動半導體產業
India’s cabinet has approved a ₹37.06 billion (USD 435 million) semiconductor fabrication facility to be developed jointly by HCL Group and Taiwan’s Foxconn, according to a Reuters report. The plant, to be located near Jewar airport in Uttar Pradesh, will produce up to 36 million display driver chips annually for devices such as smartphones, laptops, automobiles, and PCs. With a planned monthly capacity of 20,000 wafers, commercial production is expected to begin in 2027. The project is the sixth approved under the India Semiconductor Mission, a key component of Prime Minister Narendra Modi’s strategy to bolster domestic chip manufacturing in a country that currently lacks a fully operational fab.
The HCL-Foxconn announcement follows earlier setbacks, including the collapse of Foxconn’s joint venture with Vedanta in 2023 due to concerns over escalating costs and delays in government incentives. Still, India’s chip ambitions continue to gain momentum. Taiwan’s PSMC and Tata Electronics are building a $11 billion fab in Gujarat, while Micron is investing $2.7 billion in a semiconductor packaging plant. For non-Indian companies, this marks a growing opportunity to engage with India’s emerging semiconductor ecosystem, either through technology partnerships, supply chain integration, or co-investment in a market increasingly viewed as a vital alternative to China and Taiwan.
小編點評：印度內閣已批准 HCL 集團與台灣富士康合資在北方邦 Jewar 機場附近建設的晶片製造廠，總投資 4.35 億美元。該廠將每年生產高達 3,600 萬顆顯示驅動晶片，預計 2027 年開始商業量產，是「印度半導體使命」下批准的第六座工廠。儘管富士康與 Vedanta 的前一合資案於 2023 年破局，印度晶片政策仍持續推進。台灣力積電（PSMC）與塔塔電子也在古吉拉特邦建設 110 億美元晶圓廠，美光（Micron）亦投資 27 億美元在封裝廠。對非印度企業而言，這為進入快速成長中的印度半導體供應鏈提供了合作與共投機會。
Pegatron Acquires HTC Taiwan Factories, Boosts India Investments Amid Global Expansion
和碩收購台灣 HTC 工廠，擴大印度投資，深化全球擴張布局
Pegatron Corporation, a key assembler for Apple’s iPhones, is expanding its global manufacturing footprint with a dual-pronged strategy: acquiring HTC’s factory assets in Taiwan and increasing its investment in India. The company will spend NT$5.64 billion (approximately USD 187 million) to acquire HTC’s factories in Taoyuan, expected to finalize by Q3 2025. These facilities will enhance Pegatron’s capacity to produce consumer electronics, communication devices, and computing products. Additionally, Pegatron is investing NT$578.57 million in India, targeting expansion in communications equipment manufacturing with plans to enter the automotive electronics sector. These moves come as Pegatron also prepares to unveil its latest innovations in AI, smart mobility, and healthcare at the upcoming Computex trade show in Taipei.
The developments follow reports of Tata Group rebranding Pegatron’s India unit as part of its own growing smartphone manufacturing operations. Pegatron’s push into India complements broader industry efforts to diversify beyond China amid tariff concerns and currency fluctuations, which the company says have had minimal impact on revenue. For non-Indian companies, this signals an ongoing shift in global supply chains and a maturing Indian electronics manufacturing ecosystem. It opens the door for foreign suppliers, logistics providers, and technology partners to collaborate with major OEMs as India becomes an increasingly strategic production hub in both consumer and industrial electronics.
小編點評：和碩（Pegatron）將以 56.4 億新台幣（約 1.87 億美元）收購 HTC 位於台灣桃園的工廠資產，預計 2025 年第三季完成交易。該廠將用於生產消費性電子、通訊裝置與運算設備。另方面，和碩也將向印度通訊設備製造事業投資新台幣 5.78 億元，並計劃進軍車用電子領域。同時，和碩亦在台北國際電腦展（Computex）展示其 AI、智慧移動與醫療創新。此舉與塔塔集團將和碩印度子公司品牌重塑為其智慧手機製造體系一部分相呼應。此發展強化印度在全球供應鏈中的地位，為外部供應商、物流商與科技夥伴提供與 OEM 合作的機會。
Renesas Opens India’s First 3nm Chip Design Centers, Marking Leap in Semiconductor Innovation
Renesas 在印度設立首個 3 奈米晶片設計中心，邁入先進半導體時代
Union Minister for Electronics & IT Ashwini Vaishnaw inaugurated two advanced semiconductor design centers of Renesas Electronics India in Noida and Bengaluru on 13 May, marking a major step forward in India’s chip design capabilities. These facilities include the country’s first design center focused on next-generation 3 nanometer (nm) chips, building on earlier achievements at 5nm and 7nm levels. The minister emphasized the milestone as a turning point in India’s holistic semiconductor strategy, which spans the entire value chain from design and fabrication to packaging and raw materials. He noted rising global investor interest and credited Prime Minister Modi’s Aatmanirbhar Bharat vision for the industry’s rapid rise over the past three years.
Renesas CEO Hidetoshi Shibata reaffirmed India’s strategic importance, announcing plans to expand the company’s local footprint and support more than 250 academic institutions and startups through initiatives like Chips to Startup (C2S) and the Design Linked Incentive (DLI) Programme. With design hubs now operating in Noida, Bengaluru, and Hyderabad, Renesas aims to build end-to-end capabilities in India across automotive, industrial, infrastructure, and IoT segments. For non-Indian companies, this development highlights India’s growing role in advanced chip R&D and presents opportunities for partnerships in design, training, and supply chains as global players look to diversify beyond traditional semiconductor hubs.
小編點評：Renesas Electronics India 在諾伊達與班加羅爾設立兩座先進半導體設計中心，標誌著印度首次進入 3 奈米晶片設計階段，並延續其在 5 奈米與 7 奈米領域的成果。印度電子與 IT 部長 Vaishnaw 表示，此舉為印度在設計、製造到封裝與原料的半導體價值鏈轉型立下重要里程碑，並吸引全球投資。Renesas 執行長柴田英利（Hidetoshi Shibata）重申印度在公司戰略中的重要性，並將擴大在印度與超過 250 間學術機構與新創的合作。此舉顯示印度在全球晶片研發中的角色日益重要，為國際企業提供設計、培訓與供應鏈合作的機會。
U.S. Drops AI Chip Export Limits, Opening Doors for Global Allies Including India
美國取消 AI 晶片出口限制，為包含印度在內的盟友開啟合作大門
In a major policy reversal, the United States has officially withdrawn the controversial “AI diffusion rule” that sought to limit the global export of advanced artificial intelligence (AI) chips. Announced by David Sacks, the new White House lead on AI policy, at the Saudi-US Investment Forum, the move is expected to benefit countries like India that are rapidly scaling AI infrastructure and have lobbied for greater access to high-performance chips from companies like Nvidia. Originally introduced during the final phase of the Biden administration, the rule categorized countries into tiers and imposed restrictions even on U.S. allies, prompting concern among global governments and chipmakers.
Now under President Donald Trump’s administration, the policy shift is being framed as an effort to deepen cooperation with trusted international partners while maintaining safeguards against tech transfer to rivals such as China. For non-Indian companies, especially in AI hardware, cloud computing, and semiconductor manufacturing, the reversal signals a more open global market for U.S. chip technology. It presents new opportunities for collaboration, expansion, and supply chain diversification across emerging AI markets, while reinforcing the need for careful compliance mechanisms to prevent backdoor access by restricted actors.
小編點評：美國正式撤銷拜登時期實施的「AI 擴散規則」（AI diffusion rule），該政策原限制先進 AI 晶片出口，即使是對美國盟友也設下限制，引發各國政府與晶片商憂慮。新任 AI 政策負責人 David Sacks 在沙烏地－美國投資論壇上宣布該變革，表示這將有利於像印度這類 AI 基礎設施快速成長的國家，尤其可更容易取得 Nvidia 等公司晶片。新政策在川普政府下推動，強調深化與可信賴國際夥伴的合作，同時防堵技術轉移至中國等競爭對手。此舉為 AI 硬體、雲端計算與半導體企業打開全球市場，創造供應鏈多元化與合作新契機。