Driven by the global “China Plus One” strategy and the rapid restructuring of electronics supply chains, the TAI Bond (Taiwan ASEAN India Bond) project remains dedicated to bridging Taiwan’s ICT prowess with high-growth markets across ASEAN and India.
Following a highly competitive review session last week, our evaluation committee has finalized the selection for the upcoming TCA Pavilion at electronica India 2026, taking place this September in Bengaluru. The caliber of innovation and market readiness demonstrated by all applicants was exceptional.
We are pleased to officially announce the 5 selected companies and 3 waitlisted teams heading to India’s tech hub:
🏆 Selected Companies
(In alphabetical order)
- Alpenglow Tek (臻至科技)
- Fuho Technology (馥鴻科技)
- Goldkey Technology (凌航科技)
- Optiqb AI Technology (光影立方)
- SMANEX (全穎智聯)
💡 Waitlist
(In order of priority)
- EcoHeal-Tec (翔兆科技)
- AIFA Technology (艾法科技)
- Apollo Power (阿波羅電力)
📌 Next Steps & Onboarding
- Official Notifications: Detailed onboarding packages, contract signing procedures, and project timelines will be sent individually via EMAIL to the selected teams in the coming days. Please ensure your designated contact checks their inbox regularly.
- Waitlist Activation: In the event that a selected company forfeits its participation, the project team will contact the waitlisted companies sequentially based on the priority order listed above.
Moving Forward
We extend our sincere appreciation to all the enterprises and startups that applied. The TAI Bond team looks forward to partnering with this year’s selected cohort to unlock new milestones, deepen cross-border collaboration, and capture strategic opportunities in the global electronics manufacturing ecosystem.