Indian Weekly News Updates: Jan. 14 to Jan. 20, 2026

Foxconn–HCL unveil ‘India Chip Pvt Ltd’ OSAT venture
鴻海與印度 HCL 聯手,成立「India Chip」半導體封測合資公司

Taiwanese electronics manufacturing services major Foxconn and India’s HCL Group have named their semiconductor joint venture India Chip Private Limited, according to regulatory filings. Foxconn holds a 40 percent stake in the venture and has infused $37.2 million (around Rs 312 crore) so far, with a potential total investment of up to Rs 424 crore. The joint venture, first announced on October 1, 2024, confirmed in a supplementary disclosure that the entity’s name has now been finalised. Earlier, HCL had submitted the project proposal to the Uttar Pradesh government under the name Vama Sundari while seeking land allocation.

The Uttar Pradesh government’s Yamuna Expressway Industrial Development Authority has allotted about 48 acres in Sector 28, Jewar, near the upcoming Noida International Airport, for an outsourced semiconductor assembly and test (OSAT) facility focused on display driver integrated circuits used in smartphones, laptops, and automotive applications. The plant is designed to process 20,000 wafers per month, with an annual capacity of around 432 million chips, involving an estimated investment of Rs 3,706 crore and generating over 3,500 jobs. The state government has committed 60 percent capital support, along with assured power and water supply, and commercial production is expected to begin in 2027. For non-Indian companies, the project underscores India’s push to integrate into global semiconductor supply chains, creating opportunities for equipment makers, material suppliers, and downstream electronics firms seeking alternative manufacturing and packaging bases outside traditional East Asian hubs.

https://www.moneycontrol.com/news/business/foxconn-hcl-name-semiconductor-jv-india-chip-pvt-ltd-13775466.html

小編點評:鴻海和印度HCL已正式將半導體合資企業命名為印度晶片有限公司(India Chip Pvt Ltd),鴻海持有40%的股份,投資額高達42.4億盧比。北方邦政府已在傑瓦爾(Jewar)劃撥48英畝土地,用於建造一座價值370.6億盧比的OSAT(外包半導體組裝和測試)工廠,預計將於2027年投產,創造3500個職位,本案將強化印度在全球半導體供應鏈中的地位。

IIT Gandhinagar ties up with Taiwan’s NYCU, Ampak for chip R&D
印度理工學院甘地訥格爾分校(IITGN)攜手台灣陽明交大、正基科技,展開晶片研發合作


Indian Institute of Technology Gandhinagar (IITGN) has strengthened its collaboration with Taiwan’s National Yang Ming Chiao Tung University (NYCU) and wireless module maker Ampak Technology Inc. to advance India–Taiwan cooperation in semiconductors and advanced communications. The partnership was reinforced during a campus visit on January 13–14 by Prof. Li-Chun Wang, Distinguished Chair Professor and Dean at NYCU, and Mr. Ming-Jer Chen, CEO of Ampak Technology, which has over two decades of experience in wireless module R&D, design, manufacturing, and technology integration. Discussions focused on academic exchange programmes, joint research initiatives, and industry-academia partnerships covering areas such as integrated circuit design, semiconductor materials, AI, machine learning, quantum computing, and wearable electronics.

Highlighting the strategic importance of semiconductors and supply-chain resilience, Prof. Wang said the collaboration between India and Taiwan should span AI, systems design, and manufacturing, combining Taiwan’s strengths in manufacturing and reliability testing with India’s capabilities in chip design and computational sciences. IITGN Director Prof. Rajat Moona said the engagement would provide students with hands-on exposure and advanced training as Gujarat emerges as a semiconductor hub, while Ampak’s CEO noted the strong potential for joint research and student mobility between India and Taiwan. For non-Indian companies, the initiative signals India’s growing integration into global semiconductor and wireless ecosystems, opening avenues for international firms in equipment, materials, design services, and advanced packaging to collaborate with Indian and Taiwanese institutions as part of a diversifying and geopolitically resilient technology supply chain.

https://indiaeducationdiary.in/iit-gandhinagar-partners-with-taiwanese-university-industry-to-boost-india-taiwan-semiconductor-partnership/

小編點評:印度理工學院甘地納加分校(IIT Gandhinagar)與台灣陽明交通大學(NYCU)和正基科技(Ampak Technology)合作,透過聯合研究、學術交流和產學合作,加強台印在半導體、人工智慧、量子運算和先進通訊領域的合作。該聯盟旨在結合台灣的製造優勢和印度的晶片設計專長,為學生提供實務培訓,同時將古加拉特邦打造為半導體中心,並將印度融入全球供應鏈。

India, EU seek to finalise trade deal this month
印度與歐盟力拼本月完成貿易協定談判

India expects negotiations on its long-sought trade agreement with the European Union to conclude this month, Trade Secretary Rajesh Agrawal said, potentially paving the way for New Delhi’s largest trade pact as it looks to diversify markets amid U.S. tariff pressures. Bilateral trade between India and the EU stood at 120 billion euros in 2024, making the bloc India’s biggest trading partner. Agrawal said both sides were “very close” to finalising the agreement and were exploring whether it could be wrapped up ahead of an India–EU summit in New Delhi later this month, to be co-chaired by European Council President Antonio Costa and European Commission President Ursula von der Leyen. Talks on a separate U.S. trade pact are continuing after negotiations collapsed last year, while India and the EU have sought to fast-track their deal since relaunching talks in 2022.

Key sticking points remain over automobiles and steel, with the EU pressing India to sharply cut import duties on cars that can exceed 100 percent, and India concerned that its steel exports could be constrained by the EU’s carbon border levy and safeguard measures. Agriculture and dairy have been excluded from negotiations, as India has ruled out opening these sectors to protect millions of small farmers, while the EU is also seeking lower tariffs on medical devices, wine, spirits and meat, along with stronger intellectual property rules. India, for its part, wants duty-free access for labour-intensive exports and faster regulatory recognition for its autos and electronics sectors. For non-Indian companies, a successful deal would signal a major reconfiguration of trade flows by opening access to India’s 1.4-billion-strong consumer market and strengthening EU–India supply chains as both sides seek to reduce dependence on China and Russia, potentially creating new opportunities for manufacturers, exporters and investors operating across Asia and Europe.

https://www.reuters.com/world/india/trade-deal-with-eu-close-says-india-trade-secretary-2026-01-15

小編點評:印度和歐盟本月即將敲定一項重要的貿易協議可望成為新德里迄今為止最大規模的貿易協定。雙方都希望在即將於新德里舉行的峰會之前,實現分散市場並加強供應鏈。關鍵癥結在於歐盟要求降低汽車關稅,碳邊境稅和保護措施,(ah+)以及強化智慧財產權,而印度則尋求勞動密集型產品(農業除外)的免稅准入,加快對其汽車和電子業的監管認證流程(ah+)。如果協議最終達成,將重塑貿易格局,並向歐洲企業開放印度龐大的消費市場。

India to relax foreign investment norms for defence companies
印度將放寬國防工業外資投資規範

India is preparing to significantly relax foreign investment norms in its defence sector to attract greater overseas participation and strengthen domestic manufacturing, according to government sources. The cap on foreign direct investment in defence companies holding existing licences under the automatic route—where no prior government approval is required—is set to be raised to 74 percent from 49 percent. At present, foreign investors can own up to 74 percent under the automatic route only in firms seeking new licences. The government is also considering removing a condition that allows foreign ownership beyond 74 percent only if it leads to access to “modern technology,” a clause critics have long described as vague. The proposed reforms, which could be implemented within the next few months, aim to encourage defence partners to take majority stakes in Indian ventures and expand manufacturing capacity following last year’s conflict with Pakistan.

Another rule likely to be dropped is the requirement for fully export-oriented defence manufacturers to establish domestic maintenance and support facilities, which officials say has deterred investment. Foreign defence firms such as Airbus, Lockheed Martin and Israel’s Rafael already operate in India through joint ventures or partnerships, but foreign equity inflows into the sector have remained limited at $26.5 million over the past 25 years. The move comes as India seeks a 20 percent rise in defence spending in the 2026/27 budget and targets nearly doubling domestic defence production to $33.25 billion and exports to $5.5 billion by 2029, after exports hit a record $2.6 billion in 2024/25. For non-Indian companies, the planned liberalisation could open the door to majority ownership in Indian defence firms, offering access to one of the world’s largest arms markets and positioning India as a manufacturing and export base amid rising global defence demand and shifting supply chains.

https://www.reuters.com/world/india/india-ease-rules-boost-foreign-investment-domestic-defence-firms-sources-say-2026-01-16

小編點評:印度計劃放寬國防領域的外商投資規則,將現有許可證持有者的自動審批持股上限從49%提高到74%,並取消必須與「當代技術」貼近的限制,旨在吸引更多海外投資並擴大國內製造業規模。預計這些改革將在數月內實施,到2029年,印度國防生產規模預計將達到332.5億美元,出口額達到55億美元,這將使印度的武器市場向外資開放,並打造印度成為全球製造業中心。

India pushes BRICS digital currency link for cross-border payments
印度推動金磚國家數位貨幣串聯,以優化跨境支付

India’s central bank has proposed linking the official digital currencies of BRICS countries to facilitate cross-border trade and tourism payments, in a move that could gradually reduce reliance on the U.S. dollar amid rising geopolitical tensions, according to sources. The Reserve Bank of India (RBI) has recommended that the proposal be placed on the agenda of the 2026 BRICS summit, which India will host later this year. If accepted, it would mark the first formal attempt to connect the central bank digital currencies (CBDCs) of BRICS members—Brazil, Russia, India, China and South Africa. The initiative builds on a 2025 BRICS declaration calling for interoperability among members’ payment systems, and aligns with the RBI’s stated interest in linking India’s e-rupee with other nations’ digital currencies to speed up cross-border transactions, though it has said this is not aimed at promoting de-dollarisation.

All major BRICS members are currently running CBDC pilot projects, with India’s e-rupee attracting about 7 million retail users since its 2022 launch and China seeking to expand international use of the digital yuan. Officials said key challenges would include agreeing on interoperable technology, governance rules and mechanisms to manage trade imbalances, with bilateral foreign exchange swap arrangements and periodic settlements among options under discussion. The proposal comes as the bloc gains prominence amid renewed U.S. tariff threats and warnings against efforts to bypass the dollar. For non-Indian companies, especially exporters, payment service providers and fintech firms, a BRICS-linked digital currency framework could reshape regional payment infrastructure by lowering transaction costs and settlement times across emerging markets, while also introducing new regulatory and currency-risk considerations for businesses trading with BRICS economies.

https://www.trtworld.com/article/a3272009c4dc

小編點評:印度央行提議將金磚國家的數位貨幣連結起來,以加速跨國貿易和旅遊支付。該計劃將在2026年新德里金磚國家峰會上進行討論。儘管所有成員國都在開展各國的央行數位貨幣(CBDC)試點計畫,但互通性和治理方面仍存在挑戰。不過,一個成功的框架有望降低交易成本,重塑區域支付體系,並為全球出口商和金融科技公司創造新的機會。

India, Germany sign 19 deals on defence and technology
印度與德國簽署 19 項協議,深化國防與科技合作

India and Germany have strengthened their strategic partnership by signing 19 agreements and joint declarations covering defence manufacturing, advanced technology, critical minerals and trade cooperation. The deals were finalised following talks between Prime Minister Narendra Modi and German Chancellor Friedrich Merz, reflecting growing trust between the two countries and a shared push to enhance economic growth, innovation and global supply-chain resilience. The agreements span defence, trade, semiconductors and emerging technologies, with both sides committing to expand co-development and co-production in defence manufacturing as well as cooperation in digitalisation, telecommunications, health and the bio-economy.

A key outcome was the launch of the India–Germany Semiconductor Ecosystem Partnership, aimed at collaboration across the full semiconductor value chain from research to manufacturing, alongside joint efforts in critical minerals covering exploration, processing, recycling and secure supply chains. Defence and security cooperation will deepen through joint production, training and military exercises, while naval engagement will expand with regular port calls and exchanges, supported by a new Track 1.5 Foreign Policy and Security Dialogue. Bilateral trade has crossed $50 billion, and Germany will allow visa-free airport transit for Indian passport holders, easing mobility. For non-Indian companies, the agreements signal expanding opportunities in defence manufacturing, semiconductors, clean-energy minerals and digital technologies, as stronger India–Germany ties could reshape supplier networks and create new partnerships within Europe–Asia industrial and technology ecosystems.

https://currentaffairs.adda247.com/india-germany-sign-19-strategic-deals-to-boost-defence-tech-and-minerals-cooperation

小編點評:印度和德國簽署了19項協議,涵蓋國防、半導體、關鍵礦產和先進技術等領域,凸顯了雙方在共同研發、貿易和供應鏈韌性方面的深化合作。主要成果包括建立印德半導體生態系統夥伴關係、擴大國防合作、簡化印度護照簽證流程,以及為全球企業在歐亞產業網絡中創造新的機會。